Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Laser Assisted Chemical Mechanical Polishing for Planarization

Layout Optimization with Dummy Features for Chemical - Mechanical Polishing Manufacturability

Acknowledgments The duration of my Ph.D. study in the computer sciences department at the University of Texas at Austin is an interesting period of my life that I will always treasure. People in different circles have touched my life in this period. I wish to thank all of them sincerely from the bottom of my heart. Foremost, on the academic front, I wish to thank my committee members, especiall...

A Mechanical Model for Erosion in Copper Chemical-mechanical Polishing

The Chemical-mechanical polishing (CMP) process is now widely employed in the ultra-large-scale integrated semiconductor fabrication. Due to the continuous decrease in the sub-micron feature size, characterization of erosion has become an important issue in Cu CMP. In this paper, the erosion in Cu CMP is considered at two levels: wafer and die levels. Erosion models are developed based on the m...

Chemical Mechanical Polishing by Colloidal Silica Slurry

Chemical Mechanical Polishing is a unique process enabling technology that allows chip makers to readily drive lithographic patterning steps to smaller dimensions, an ages old, “retro” technology related to glass polishing and metallographic finishing, thus enabling optical lithography to work. It represents a situation that is a true paradigm shift from the typical way in which technological a...

Chemical mechanical polishing of thin film diamond

The demonstration that Nanocrystalline Diamond (NCD) can retain the superior Young’s modulus (1100 GPa) of single crystal diamond twinned with its ability to be grown at low temperatures (<450 C) has driven a revival into the growth and applications of NCD thin films. However, owing to the competitive growth of crystals the resulting film has a roughness that evolves with film thickness, preven...